Selenium nanoparticles against cold stress: a molecular and physio-biochemical perspective in buckwheat
Cold stress causes significant limitations in plant growth and metabolism, ultimately leading to yield losses. This study investigated the protective effect of selenium nanoparticles (SeNPs) against cold stress in buckwheat (Fagopyrum esculentum Moench) at physiological, biochemical, and molecular levels. Seedlings of cold-tolerant Aktas and cold-sensitive Gunes genotypes were grown under hydroponic conditions for 12 days. SeNPs were applied to the plants via foliar spray at doses of 4, 6, and 8 mg L-& sup1;, 24 h before the cold stress application. The plants were then exposed to temperatures of 5, 10, 15, and 25 degrees C for 4 days. It was determined that cold stress caused significant reductions in root and shoot length, relative water content (RWC), and chlorophyll index (SPAD) values, and significant increases in cell membrane damage in both genotypes. These negative effects were more pronounced in the cold-sensitive Gunes genotype. Furthermore, significant increases in malondialdehyde (MDA), proline, total soluble sugars, and quercetin content were detected under cold stress conditions. SeNP applications, on the other hand, significantly mitigated the negative effects of cold stress by improving growth and physiological parameters, reducing membrane damage and lipid peroxidation, and stabilizing osmolyte and secondary metabolite accumulation. Gene expression studies using qRT-PCR revealed that the expression levels of the PAL, F3 ' H, and F3 ' 5 ' H genes involved in the quercetin metabolic pathway varied depending on genotype, temperature, and SeNP dose. The findings demonstrate that SeNPs enhance cold stress tolerance in buckwheat by increasing physiological resilience and regulating flavonoid metabolism. This study shows that SeNPs can be used as an effective and innovative biostimulant in enhancing abiotic stress tolerance in plants.
- Journal
- PLANT CELL TISSUE AND ORGAN CULTURE
- Year
- 2026
- Volume
- 164
- Issue
- 3
- ISSN
- 0167-6857
- eISSN
- 1573-5044
- DOI
- 10.1007/s11240-026-03363-9
- WoS UID
- WOS:001695273000002