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Article 2021 · 9 citations

Influence of thickness of the sputtered diamond-like carbon (DLC) on electronic and dielectric parameters of the Au/DLC/n-Si heterojunction

Kurt, Mustafa Sukru, Yildirim, Fatma, Orhan, Zeynep, Aydogan, S.

Abstract

The electrical and dielectric properties of the Au/DLC/n-Si heterojunction were investigated in detail by coating the diamond-like carbon (DLC) layers of different thicknesses on Si by the magnetron sputtering. The influence of DLC thickness on the Au/DLC/n-Si heterojunction is the main objective of the study. For this purpose, the current-voltage measurements of the heterojunction were performed as a function of the thickness (10 (D1), 20 (D2), and 50 nm (D3) DLC layer) and it was seen that the device with 50 nm thickness had the best rectifying property (the lowest ideality factor) and stable reverse current, the lowest interface states, the highest dielectric parameter (K), and shunt resistances. And then the capacitance/conductance versus voltage measurements of the heterojunctions were carried out to determine the electrical and dielectric properties of the devices at 500 kHz applied frequency. Some improvements in the high dielectric parameter D3 device were attributed to further limitation of the leakage current. The experimental results suggested that both the complex dielectric parameter (K*) and loss tangent (tan delta) were a function of the bias voltage and frequency due to the existence of the surface states and dipole polarizations. Experimental results showed that the DLC layer causes surface passivation on Si, resulting in improved device with increasing thickness, and the DLC/n-Si device is a candidate device for high voltage applications.

Keywords
AC ELECTRICAL-CONDUCTIVITY KAPPA GATE DIELECTRICS SCHOTTKY DIODE THIN-FILMS VOLTAGE OXIDE DEPOSITION FREQUENCY CONSTANT MODULUS
WoS Categories
Engineering, Electrical & Electronic Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter
Citation
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Year
2021
Volume
32
Issue
20
Pages
25214-25224
ISSN
0957-4522
eISSN
1573-482X
DOI
10.1007/s10854-021-06977-1
WoS UID
WOS:000696437300002
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