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Article 2022 · 23 atıf

Development of Tincal based polypropylene polymeric materials for radiation shielding applications: Experimental, theoretical, and Monte Carlo investigations

Ekinci, N., Mahmoud, K. A., Saritas, S., Aygun, Bunyamin, Hessien, M. M., Bilici, Ibrahim, Rammah, Y. S.

Özet

Samples of new polymeric material based on polypropylene doped with various Tincal concentrations have been developed. The prepared samples are coded PT1, PT2, PT3, and PT4. The structural characteristics of the produced polymeric materials were investigated using X-ray diffraction (XRD) and Raman Spectroscopy. The obtained materials' shielding capacity was studied in terms of mass attenuation coefficient and half-value layer. The mass attenuation coefficient was experimentally estimated using a high-resolution Si (Li) detector and a multichannel analyzer with multiple variable sources, and the findings were then compared with the Phy-X/PSD and MCNP algorithms. The existence of two bands at 2.770-2.830 cm-1 and 1.405-1.455 cm-1 in the Raman spectra can be attributed to CH2 vibration modes. Due to the increased density of the sample, Tincal enhancement with greater ratios has a beneficial influence on linear attenuation coefficient (LAC) values. This led the samples to be sorted in the following order: PT1<PT2<PT3<PT4 in terms of LAC. The greatest half value layer (HVL) values for PT1 were found to be between 0.876 and 41.24 cm. Furthermore, the PT4 values were the lowest, ranging from 0.491 to 32.291 cm at 0.015 and 15 MeV, respectively. The obtained results introduced the PT4 sample as the best shield against gamma rays among all prepared samples.

Anahtar Kelimeler
Raman shift XRD Tincal Polypropylene Shielding capacity ATTENUATION COEFFICIENTS PHOTON PARAMETERS FEATURES WINXCOM CODE
WoS Kategorileri
Engineering, Electrical & Electronic Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter
Künye
Dergi
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
Yıl
2022
Cilt
146
ISSN
1369-8001
eISSN
1873-4081
DOI
10.1016/j.mssp.2022.106696
WoS UID
WOS:000794300700001
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