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EH

Efeoglu, Hasan

21 yayın · 151 atıf · 2021–2025

Yayın
21
Atıf
151
Yıllar
4
Yayınlar
Başlık Yıl Tip Atıf
Temperature-Dependent <i>I</i>-<i>V</i> Characteristics of Schottky Diodes: A Comprehensive Review of Barrier Height, Ideality Factor, and Series Resistance
JOURNAL OF ELECTRONIC MATERIALS
2025 Review 0
Characterization of Ta<sub>x</sub>O<sub>5-y</sub> thin films grown by HiPIMS reactive sputtering for temperature sensing applications
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
2025 Article 0
Influence of nitrogen concentration on the temperature sensing and resistor properties of TaN thin films at cryogenic temperatures
MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
2025 Article 0
Room temperature current conduction mechanisms in Ba<sub>0.5</sub>Sr<sub>0.5</sub>TiO<sub>3</sub> and Ba<sub>0.5</sub>Sr<sub>0.5</sub>TiO<sub>3</sub>/TiO<sub>2</sub> multilayer memristor structures
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
2025 Article 1
Experimental current-voltage-temperature and thermal sensitivity behaviors of an ideal Schottky barrier diode over a wide temperature range
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
2025 Article 4
Investigation of the memristive properties of the device form and thin film form of BST and CeO<sub>2</sub> films with different arrays
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
2025 Article 0
Numerical Analysis of Thermal Sensitivity Characteristics by Pinch-Off Model in Inhomogeneous Schottky Barrier Diodes
JOURNAL OF ELECTRONIC MATERIALS
2025 Article 4
Current-Voltage Characteristics of Pt Metal-based and PtSi Silicide-based <i>n</i>-Si Schottky Diodes over a Wide Measuring Temperature Range
JOURNAL OF ELECTRONIC MATERIALS
2023 Article 18
An experimental study: Dependence of Schottky diode parameters on Schottky contact area size
OPTICAL MATERIALS
2023 Article 14
Thermal sensing capability and current-voltage-temperature characteristics in Pt/<i>n</i>-GaP/Al/Ti Schottky diodes
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
2023 Article 15
Analysis and Comparison of the Main Electrical Characteristics of Cu/n-type Si metal semiconductor structures at wide temperature Range
SILICON
2022 Article 3
Thermal sensitivity and current-voltage-temperature characteristics in Pt/epitaxy<i> n</i>-Si/<i>n</i><SUP>+</SUP>Si structures as a function of Schottky contact area
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
2022 Article 11
Current-voltage-measurement temperature characteristics depending on the barrier-forming contact metal thickness in Au/Cu/<i>n</i>-Si/Au-Sb/Ni rectifying contacts
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
2022 Article 8
Formation of a Ti → TiO<sub>2</sub>-graded layer and its effect on the memristive properties of TiO<sub><i>x</i></sub>(/Ti/TiO<sub><i>x</i></sub>) structures
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
2022 Article 4
A highly stable temperature sensor based on Au/Cu/n-Si Schottky barrier diodes dependent on the inner metal thickness
JOURNAL OF PHYSICS D-APPLIED PHYSICS
2022 Article 15
Thermal sensitivity from current-voltage-measurement temperature characteristics in Au/<i>n</i>-GaAs Schottky contacts
TURKISH JOURNAL OF PHYSICS
2021 Article 20
Memristiv effect on W/Ti/p-Si structure: Aging phenomena and one of the origin of barrier inhomogeneity
MATERIALS TODAY-PROCEEDINGS
2021 Proceedings Paper 0
Temperature dependence of interface-state density distributions in Cu/CuO/n-type Si structures
MATERIALS TODAY-PROCEEDINGS
2021 Proceedings Paper 0
Effect of the Al<sub>2</sub>O<sub>3</sub> interfacial layer thickness on the measurement temperature-induced I-V characteristics in Au/Ti/Al<sub>2</sub>O<sub>3</sub>/<i>n</i>-GaAs structures
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
2021 Article 13
AN APPLICATION OF R-HiPIMS METHOD FOR TiO<sub>2</sub>- AND TiO<sub>2</sub>:Cu-BASED MEMRISTORS: CONTROLLING Cu DOPING USING DC PULSE METHOD
SURFACE REVIEW AND LETTERS
2021 Article 0
Temperature dependence of electrical parameters of the Cu/n-Si metal semiconductor Schottky structures
JOURNAL OF MOLECULAR STRUCTURE
2021 Article 21